+48 22 5128 100  

Szachowa 1,
04-894 Warszawa


Call for Papers

4th workshop on

Technology for Data Center Interconnects


in conjunction with ICTON

20th Anniversary International Conference on Transparent Optical Networks

July 1 - 5, 2018 – Bucharest, Romania


Technically (co-)sponsored by the IEEE Photonics Society


Scope of the workshop

Electrical interfaces in data centers down to chip-to-chip and intra-chip connections have been identified as main bottlenecks for continuing development as their bandwidth and density will soon approach physical limits. Optical interconnection  based on nano-scale photonic integrated circuits technology have been given much attention in recent years and the rapid development of the photonic integration technology is showing great promises for the deployment in the next generation data centers, including reduced power consumption, small footprint and increased bandwidth and functionalities. This workshop aims to provide a forum for international experts to present and discuss the visions and perspectives of these technologies including recent progresses and future prospects and challenges for applications. Topics of relevance include but are not limited to:

  • Basic methods and theory for optical interconnects
  • Integrated silicon photonics
  • Other technology platforms
  • Waveguiding and passive devices
  • Active cables and connections
  • Light sources and detectors for interconnects
  • Switches and modulators
  • Testing, packaging and reliability

Technical Program Committee


Jarosław Turkiewicz   Warsaw University of Technology, Poland
Sergei Popov  Royal Institute of Technology KTH, Sweden
Lech Wosinski Royal Institute of Technology KTH, Sweden


Lars Thylén Royal Institute of Technology KTH, Sweden
Richard de La Rue     University of Glasgow, UK
Seppo Honkanen University of Eastern Finland
Daoxin Dai Zhejiang University, Hangzhou, China

Paper submission

According to ICTON submission rules at  https://www.itl.waw.pl/pl/icton2018 (max. of 4 pages in MS Word accompanied by a PDF version),  please write DACINT in the subject line when submitting your contribution. All accepted DACINT papers will be included in ICTON 2018 Proceedings (IEEE publication). Please, send your paper to  https://www.itl.waw.pl/pl/icton2018 by March 31, 2018.

The authors will be notified on the acceptance by April 30, 2018. Post-deadline papers with very recent results are requested by June 1, 2018.