ICTON 2017 - DACINT Drukuj Email
Wpisany przez Marek Jaworski - czwartek, 30 marca 2017 12:41 | Zmieniony: czwartek, 30 marca 2017 13:04   

Call for Papers

3rd workshop on

Technology for Data Center Interconnects (DACINT)

co-organized by FP7-ADDAPT (www.addapt-fp7.eu) and
H2020-DIMENSION (www.dimension-h2020.eu) projects

in conjunction with ICTON

19th International Conference on Transparent Optical Networks

Girona, Spain, July 2-6, 2017 http://icton2017.udg.edu/

Technically co-sponsored by the IEEE Photonics Society

 

Scope of the workshop:

Electrical interfaces in data centers down to chip-to-chip and intra-chip connections have been identified as main bottlenecks for continuing development as their bandwidth and density will soon approach physical limits. Optical interconnection  based on nano-scale photonic integrated circuits technology have been given much attention in recent years and the rapid development of the photonic integration technology is showing great promises for the deployment in the next generation data centers, including reduced power consumption, small footprint and increased bandwidth and functionalities. This workshop aims to provide a forum for international experts to present and discuss the visions and perspectives of these technologies including recent progresses and future prospects and challenges for applications. Topics of relevance include but are not limited to: gather international experts on the broad topic of SDM-WDM optical networking, with an aim to promote the development of optical components, their system integration and network realization, as well as operations efficacy in light of the pressing challenges. Topics of relevance include but are not limited to:

  • Basic methods and theory for optical interconnects
  • Integrated silicon photonics
  • Other technology platforms
  • Waveguiding and passive devices
  • Active cables and connections
  • Light sources and detectors for interconnects
  • Switches and modulators
  • Testing, packaging and reliability


Technical Program Committee:

Chairs:

Lech Wosinski   
Royal Institute of Technology KTH, Sweden
Sergei Popov  Royal Institute of Technology KTH, Sweden

Members:

Lars Thylén Royal Institute of Technology KTH, Sweden
Richard de La Rue University of Glasgow, UK
Seppo Honkanen University of Eastern Finland
Daoxin Dai Zhejiang University, Hangzhou, China
Ronny Henker Technische Universität Dresden, Germany
Ioannis Tomkos AIT, Athens, Greece
Jarosław Turkiewicz   
Warsaw Univ. of Technology, Poland

Paper submission:
(max. of 4 pages in MS Word accompanied by a PDF version),  please write DACINT in the subject line when submitting your contribution. All accepted DACINT papers will be included in ICTON 2017 Proceedings (IEEE publication). Please, send your paper to Adres poczty elektronicznej jest chroniony przed robotami spamującymi. W przeglądarce musi być włączona obsługa JavaScript, żeby go zobaczyć. by March 31, 2017. The authors will be notified on the acceptance by April 30, 2017. Post-deadline papers with very recent results are requested by June 1, 2017.
Zmieniony: czwartek, 30 marca 2017 13:04